at://
/
app.bsky.feed.post
/
3mhuvpoct722l
sign in
All
4
Record
2
Post
1
PostEmbed
1
Post
by @danabra.mov
PostEmbed
by @danabra.mov
Record
by @jimpick.com
Record
by @atsui.org
+ new component
Post
VSORA Jotunn8 - 8 compute chiplets - 8 HBM3E - TSMC CoWoS-S packaging - 500 W TDP The package is just a dummy right now. Production is ramping up right now. We will have to wait until MLPerf Inference v6.1 to see how it compares to the competition.
2mo
A. Schilling
