As data centers expand, so does their need for energy. Right now, nearly 30% of their energy usage is connected to cooling. But a MechSE at Illinois team created a 3D-printed plate—with structures thinner than human hair—that could slash that ratio to a mere 1.1%. ⚡
Computer chips are becoming increasingly high powered, which means they produce more heat. This, combined with the increase in data centers, is putting a strain on the energy grid. For the past 40–50 years, computer chips have been cooled by circulating air, but air is insufficient for dissipating the heat produced by modern chips. MechSE Prof. Nenad Miljkovic, Behnood Bazmi, and team say liquid direct-to-chip cooling could offer a more effective solution.
