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XTPL, the Polish ultra-precise dispensing specialist, has sold its first UPD module in Japan for advanced chip packaging. This is also XTPL's first deployment of copper-based materials, a key category for semiconductor applications. Delivery is planned for Q4 2026.… #3Dprinting #3Dprint
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XTPL, the Polish ultra-precise dispensing specialist, has sold its first UPD module in Japan for advanced chip packaging. This is also XTPL's first deployment of copper-based materials, a key category for semiconductor applications. Delivery is planned for Q4 2026. https://3dprint.com/326961/3d-printed-chip-packaging-specialist-xtpl-enters-japanese-market/ #3Dprint #3Dprinting #Industrial
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